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HCNW2211-300 View Datasheet(PDF) - Avago Technologies

Part NameDescriptionManufacturer
HCNW2211-300 Very High CMR, Wide VCC Logic Gate Optocouplers AVAGO
Avago Technologies AVAGO
HCNW2211-300 Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
4
1.55
(0.061)
MAX.
4.00
(0.158)
MAX.
13.56
(0.534)
1.3
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
11.00
(0.433)
MAX.
2.29
(0.09)
1.80 ± 0.15
(0.071 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.00 ± 0.15
(0.039 ± 0.006)
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
7o NOM.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
PEAK
TEMP.
245 °C
200
160 °C
150 °C
140 °C
100
ROOM
TEMPERATURE
0
0
2.5 C ± 0.5 °C/SEC.
30
SEC.
30
3 °C + 1 °C/–0.5 °C
SEC.
PREHEATING TIME
150 °C, 90 + 30 SEC.
50
100
150
TIME (SECONDS)
PEAK
TEMP.
240 °C
SOLDERING
TIME
200 °C
PEAK
TEMP.
230 °C
50 SEC.
200
TIGHT
TYPICAL
LOOSE
250
NOTE: NON-HALIDE FLUX SHOULD BE USED.
6
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