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HCPL-0501.R1 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
HCPL-0501.R1
Fairchild
Fairchild Semiconductor Fairchild
HCPL-0501.R1 Datasheet PDF : 0 Pages
Package Dimensions
8-pin SOIC Surface Mount
8
0.164 (4.16)
0.144 (3.66)
1
0.202 (5.13)
0.182 (4.63)
0.143 (3.63)
0.123 (3.13)
0.010 (0.25)
0.006 (0.16)
0.021 (0.53)
0.011 (0.28)
0.050 (1.27) Typ.
Lead Coplanarity: 0.004 (0.10) MAX
0.008 (0.20)
0.003 (0.08)
0.244 (6.19)
0.224 (5.69)
Recommended Pad Layout
0.024 (0.61)
0.275 (6.99)
0.155 (3.94)
0.060 (1.52)
0.050 (1.27)
Dimensions in inches (mm).
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2003 Fairchild Semiconductor Corporation
HCPL0XXX Rev. 1.0.4
8
www.fairchildsemi.com
 

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