HCPL-0500.R1 View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
View to exact match
HCPL-0500.R1 Datasheet PDF : 0 Pages
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Reflow Profile
260 TP
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
240
220 TL
200
Tsmax
180
Preheat Area
tL
160
Tsmin
140
ts
120
100
80
60
40
20
0
120
240
Time 25°C to Peak
Time (seconds)
tP
360
Profile Freature
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (tS) from (Tsmin to Tsmax)
Ramp-up Rate (tL to tP)
Liquidous Temperature (TL)
Time (tL) Maintained Above (TL)
Peak Body Package Temperature
Time (tP) within 5°C of 260°C
Ramp-down Rate (TP to TL)
Time 25°C to Peak Temperature
Pb-Free Assembly Profile
150°C
200°C
60–120 seconds
3°C/second max.
217°C
60–150 seconds
260°C +0°C / –5°C
30 seconds
6°C/second max.
8 minutes max.
©2003 Fairchild Semiconductor Corporation
HCPL0XXX Rev. 1.0.4
11
www.fairchildsemi.com
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