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HCPL-050L View Datasheet(PDF) - HP => Agilent Technologies

Part Name
Description
View to exact match
HCPL-050L
HP
HP => Agilent Technologies HP
HCPL-050L Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Regulatory Information
The devices contained in this
data sheet have been approved by
the following organizations:
UL
Approval under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
Recommended Pb-Free IR Profile
tp
Tp
TL 217 °C
260 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
Tsmax 150 - 200 °C
Tsmin
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
4
 

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