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H1117M-FIX Просмотр технического описания (PDF) - Hi-Sincerity Mocroelectronics

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H1117M-FIX 1.2A Low Dropout Positive Voltage Regulator HSMC
Hi-Sincerity Mocroelectronics HSMC
H1117M-FIX Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200401
Issued Date : 2004.02.01
Revised Date : 2005.07.14
Page No. : 5/8
SOT-223 Dimension
A
B
1
C
2
3
D
E
F
G
H
a1
I
a2
3-Lead SOT-223 Plastic
Surface Mounted Package
HSMC Package Code: SJ
Marking:
Pb Free Mark
Pb-Free: " . " (Note) H
Normal: None 1 1 1 7 -
Date Code
SJ
Product Series
(ADJ,1.8,2.5,3.3,5)
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
2.90 3.10
B
6.70 7.30
C
3.30 3.70
D
0.60 0.80
E *2.30
-
F
6.30 6.70
G
1.40 1.80
H
0.25 0.35
I
0.02 0.10
a1
*13o
-
a2
0o
10 o
*: Typical, Unit: mm
SOT-89 Dimension
C
H
B
D
1
2
3
E
I
F
G
A
Marking:
Date Code
H1 1 1 7
Control Code
Pb Free Mark
Pb-Free: " " (Note)
Normal: None
Product Series
ADJ(A),1.8(B),2.5(C),3.3(D),5(E)
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
4.40 4.60
B
4.05 4.25
C
1.50 1.70
D
2.40 2.60
E
0.36 0.51
F
*1.50
-
G *3.00
-
H
1.40 1.60
I
0.35 0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
H1117 Series
HSMC Product Specification
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