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G1-233P-85-1.8 데이터 시트보기 (PDF) - National ->Texas Instruments

부품명G1-233P-85-1.8 National-Semiconductor
National ->Texas Instruments National-Semiconductor
상세내역Geode™ GX1 Processor Series Low Power Integrated x86 Solution
G1-233P-85-1.8 Datasheet PDF : 247 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Table of Contents (Continued)
5.0 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
5.1 POWER MANAGEMENT FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
System Management Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Suspend-on-Halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
CPU Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
5.1.3.1 Suspend Modulation for Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
5.1.3.2 Suspend Modulation for Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
3 Volt Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
GX1 Processor Serial Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
Advanced Power Management (APM) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
5.2 SUSPEND MODES AND BUS CYCLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
5.2.1
5.2.2
5.2.3
5.2.4
Timing Diagram for Suspend-on-Halt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
Initiating Suspend with SUSP# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
Stopping the Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Serial Packet Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
5.3 POWER MANAGEMENT REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
6.0 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
6.1 PART NUMBERS/PERFORMANCE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . 185
6.2 ELECTRICAL CONNECTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
6.2.1
6.2.2
6.2.3
6.2.4
Power/Ground Connections and Decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
6.2.1.1 Power Planes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186
NC-Designated Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Pull-Up and Pull-Down Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
Unused Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
6.3 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
6.4 RECOMMENDED OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
6.5 DC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6.5.1 Input/Output DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6.5.2 DC Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6.5.2.1 Definition of CPU Power States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
6.5.2.2 Definition and Measurement Techniques of CPU Current Parameters. . . . . . . . . . . 191
6.5.2.3 Definition of System Conditions for Measuring “On” Parameters . . . . . . . . . . . . . . . 192
6.5.2.4 DC Current Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
6.6 I/O CURRENT DE-RATING CURVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
6.6.1
6.6.2
6.6.3
Display Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
Memory Speed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
I/O Current De-rating Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
6.7 AC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
7.0 Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
7.1 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
7.1.1 Heatsink Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
7.2 MECHANICAL PACKAGE OUTLINES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
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General Description
The National Semiconductor® Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it’s the perfect solution for IA (information appliance) applications such as thin clients, interactive set-top boxes, and personal  internet access devices.

Features
General Features
Packaging:
— 352-Terminal Ball Grid Array (BGA) or
— 320-Pin Staggered Pin Grid Array (SPGA)
0.18-micron four layer metal CMOS process
Split rail design:
— Available 1.6V, 1.8V, or 2.0V core
— 3.3V I/O interface
Fully static design
Low Typical Power Consumption:
— 0.8W @ 1.6V/200 MHz
— 1.2W @ 2.0V/300 MHz
Note: Typical power consumption is defined as an average, measured running Windows at 80% Active Idle (Suspend-on-Halt) with a display resolution of 800x600x8 bpp @ 75 Hz.
Speeds offered up to 300 MHz
Unified Memory Architecture
— Frame buffer and video memory reside in main memory
— Minimizes PCB (Printed Circuit Board) area requirements
— Reduces system cost
Compatible with multiple Geode I/O companion devices provided by National Semiconductor

32-Bit x86 Processor
Supports Intel’s MMX instruction set extension for the acceleration of multimedia applications
16 KB unified L1 cache
Six-stage pipelined integer unit
Integrated Floating Point Unit (FPU)
Memory Management Unit (MMU) adheres to standard paging mechanisms and optimizes code fetch performance:
— Load-store reordering gives priority to memory reads
— Memory-read bypassing eliminates unnecessary or redundant memory reads
Re-entrant System Management Mode (SMM) enhanced for VSA technology

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