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FAN1084D View Datasheet(PDF) - Fairchild Semiconductor

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Description
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FAN1084D Datasheet PDF : 13 Pages
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FAN1084
PRODUCT SPECIFICATION
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die. This
is the lowest resistance path for heat flow. Proper mounting
ensures the best thermal flow from this area of the package to
the heat sink. Use of a thermally conductive material at the
case-to-heat sink interface is recommended. Use a thermally
conductive spacer if the case of the device must be electri-
cally isolated and include its contribution to the total thermal
resistance. The cases of the FAN1084 series are directly con-
nected to the output of the device.
U1
FAN1084
VIN
+
IN
OUT
C1
ADJ
10µF
+
R1
124
VOUT
C3 2.5V
100µF
+ C2
100µF
R2
124
Figure 6. Application Circuit
Table 1. Bill of Materials for Application Circuit for the FAN1084
Item
C1
C2, C3
R1, R2
U1
Quantity
1
2
2
1
Manufacturer
Xicon
Xicon
Generic
Fairchild
Part Number
L10V10
L10V100
FAN1084T
Description
10µF, 10V Aluminum
100µF, 10V Aluminum
124, 1%
4.5A Regulator
U1
RC1084-1.5
VIN = 3.3V
IN
OUT
+
C1
10µF
GND
VOUT 1.5V
+
C3
100µF
Figure 7. Application Circuit (FAN1084-1.5)
Table 2. Bill of Materials for Application Circuit for the FAN1084-1.5
Item
C1
C3
U1
Quantity
1
1
1
Manufacturer
Xicon
Xicon
Fairchild
Part Number
L10V10
L10V100
FAN1084T-1.5
Description
10µF, 10V Aluminum
100µF, 10V Aluminum
4.5A Regulator
8
REV. 1.0.8 11/10/03
 

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