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FST3125 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FST3125
Fairchild
Fairchild Semiconductor Fairchild
FST3125 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Physical Dimensions
0.43 TYP
0.65
1.65
0.45
6.10
R0.09 min
12.00°TOP & BOTTOM
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
1.00
B. DIMENSIONS ARE IN MILLIMETERS
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
R0.09min
Figure 8. 14-Lead, Thin Shrink Small Outline Package (TSSOP) MO-153, 4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2005 Fairchild Semiconductor Corporation
FST3125 • Rev. 1.0.3
8
www.fairchildsemi.com
 

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