FOD3182 View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

View to exact match

FOD3182

3A Output Current, High Speed MOSFET Gate Driver Optocoupler

Fairchild Semiconductor 

Package Dimensions

Through Hole

9.40–9.91

Pin 1

6.35–6.86

3.68–3.94

5.08

MAX

0.51 MIN

0.41–0.56

2.54 BSC

1.14–1.78

3.05–3.90

(0.78)

0.20–0.40

7.62 TYP

0.4" Lead Spacing (Option T)

9.40–9.91

Pin 1

6.35–6.86

3.68–3.94

5.08

MAX

0.51 MIN

0.41–0.56

2.54 BSC

1.14–1.78

3.05–3.90

(0.78)

15.0° MAX

10.16 TYP

0.20–0.40

Surface Mount – 0.3" Lead Spacing (Option S)

9.40–9.91

Pin 1

(1.78)

(2.54)

6.35–6.86

(7.49)

(10.54)

(1.54)

3.68–3.94

5.08

MAX

1.14–1.78

(0.76)

Recommended Land Pattern

(Option S)

0.20–0.40

0.51 MIN

2.54 BSC

(0.78)

(0.41–0.56)

0.40 MIN

Both sides

8.00 MIN

10.30 MAX

Note:

1. All dimensions are in millimeters.

2. Dimensions are exclusive of burrs, mold fash, and tie bar extrusion.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

©2010 Fairchild Semiconductor Corporation

FOD3182 Rev. 1.0.9

17

www.fairchildsemi.com

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