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FIN3385 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FIN3385 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Physical Dimensions
A
56
51
34
29
B
8.10
4.05
0.1 C
0.2 C B A
1
6
23
28
0.30
0.50
-C-
0.50
0.10 A B C
0.25
MTD56REV3
Figure 27. 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,6.1mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2003 Fairchild Semiconductor Corporation
FIN3385 / FIN3386 • Rev. 1.0.6
20
www.fairchildsemi.com
 

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