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FDS6162N7 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FDS6162N7
Fairchild
Fairchild Semiconductor Fairchild
FDS6162N7 Datasheet PDF : 6 Pages
1 2 3 4 5 6
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown
Voltage
BVDSS
TJ
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSSF
Gate–Body Leakage, Forward
IGSSR
Gate–Body Leakage, Reverse
VGS = 0 V,
ID = 250 µA
ID = 250 µA, Referenced to 25°C
VDS = 16 V,
VGS = 12 V,
VGS = –12 V ,
VGS = 0 V
VDS = 0 V
VDS = 0 V
20
V
13
mV/°C
1
µA
100 nA
–100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
gFS
Forward Transconductance
VDS = VGS,
ID = 250 µA
ID = 250 µA, Referenced to 25°C
VGS = 4.5 V, ID = 23 A
VGS = 2.5 V, ID = 19 A
VGS = 4.5 V, ID = 23 A,TJ = 125°C
VDS = 5 V,
ID = 23 A
0.6 0.9 1.5
V
–4
mV/°C
2.9 3.5 m
3.6 5.0
4.1 6.2
119
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Gate Resistance
VDS = 10 V,
f = 1.0 MHz
V GS = 0 V,
VGS = 15 mV, f = 1.0 MHz
5521
pF
1473
pF
706
pF
1.3
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = 10 V,
VGS = 4.5 V,
ID = 1 A,
RGEN = 6
VDS = 10 V,
VGS = 4.5 V
ID = 23 A,
20
32
ns
25
40
ns
85 136 ns
55
88
ns
52
73
nC
9
nC
14.5
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 2.5 A (Note 2)
trr
Qrr
Notes:
Diode Reverse Recovery Time IF = 23 A,
Diode Reverse Recovery Charge diF/dt = 100 A/µs
2.5
A
0.6 1.2
V
42
nS
52
nC
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 40°C/W when
mounted on a 1in2 pad
of 2 oz copper
b) 85°C/W when mounted on
a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS6162N7 Rev C2 (W)
 

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