datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

FDG315N View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FDG315N
Fairchild
Fairchild Semiconductor Fairchild
FDG315N Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA
30
V
BVDSS
TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
ID = 250 µA, Referenced to 25°C
VDS = 24 V, VGS = 0 V
26
mV/°C
1
µA
IGSS
Gate-Body Leakage Forward
VGS = 16 V, VDS = 0 V
100 nA
IGSS
Gate-Body Leakage Reverse
VGS = -16 V, VDS = 0 V
-100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain-Source
On-Resistance
ID(on)
GFS
On-State Drain Current
Forward Transconductance
VDS = VGS, ID = 250 µA
ID = 250 µA, Referenced to 25°C
VGS = 10 V, ID = 2 A
VGS = 10 V, ID = 2 A, TJ = 125°C
VGS = 4.5 V, ID = 1.7 A
VGS = 4.5 V, VDS = 5 V
VDS = 5 V, ID = 2 A
1
1.8
3
V
-4
mV/°C
0.100 0.12
0.140 0.20
0.130 0.16
3
A
5
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 15 V, VGS = 0 V,
f = 1.0 MHz
220
pF
50
pF
20
pF
Switching Characteristics
Id(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
(Note 2)
VDD = 15 V, ID = 1 A,
VGS = 10 V, RGEN = 6
VDS = 15 V, ID = 2 A,
VGS = 5 V
3
6
ns
11 22
ns
7
14
ns
3
6
ns
2.1
4
nC
0.8
nC
0.7
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
0.42 A
VSD
Drain-Source Diode Forward
VGS = 0 V, IS = 0.42 A
(Note 2)
Voltage
0.7 1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 170°C/W when mounted on a 1 in2 pad of 2oz copper.
b) 260°C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
FDG315N Rev. C
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]