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FAN5400 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FAN5400 Datasheet PDF : 37 Pages
First Prev 31 32 33 34 35 36 37
Physical Dimensions
BALL A1
INDEX AREA
0.03 C
2X
E
AF
B
D
TOP VIEW
0.03 C
2X
1.20
A1
Ø0.20
Cu Pad
1.60 0.40
Ø0.30 Solder
Mask Opening
0.40
RECOMMENDED LAND PATTERN
(NSMD TYPE)
0.05 C
0.06 C
0.625
0.547
E
0.378±0.018
0.208±0.021
C
SEATING PLANE
SIDE VIEWS
D
1.20
0.40
1.60
0.40
1234
0.005 C A B
Ø0.260±0.02
20X
E
D
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC020AArev2.
Figure 52. 20-Ball WLCSP, 4X5 Array, 0.4mm Pitch, 250µm Ball
Product-Specific Dimensions
Product
FAN540XUCX
D
1.960 +0.030
E
1.870 +0.030
X
0.335
Y
0.180
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN5400 Family • Rev. 1.0.7
36
www.fairchildsemi.com
 

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