FAN48610 View Datasheet(PDF) - Fairchild Semiconductor
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Description
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FAN48610 Datasheet PDF : 11 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
VIN
VOUT
SW
Voltage on VIN Pin
Voltage on VOUT Pin
SW Node
DC
Transient: 10 ns, 3 MHz
Voltage on Other Pins
ESD Electrostatic Discharge Protection Level
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
TJ
Junction Temperature
TSTG Storage Temperature
TL
Lead Soldering Temperature, 10 Seconds
Note:
3. Lesser of 6.0 V or VIN + 0.3 V.
Min. Max.
-0.3 6.0
6.0
-0.3 6.0
-1.0 8.0
-0.3 6.0(3)
5
2
-40 +150
-65 +150
+260
Unit
V
V
V
V
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
VIN Supply Voltage
IOUT Maximum Output Current
TA
Ambient Temperature
TJ
Junction Temperature
Parameter
Min.
2.5
1000
-40
-40
Max.
4.5
+85
+125
Unit
V
mA
°C
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards with vias in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction
temperature, TJ(max), at a given ambient temperature, TA.
Symbol
Parameter
Typical
Unit
ϴJA Junction-to-Ambient Thermal Resistance
50
°C/W
© 2013 Fairchild Semiconductor Corporation
FAN48610 • Rev. 1.0.0 •
3
www.fairchildsemi.com
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