Physical Dimensions
Figure 31. 9-Bump, 0.4 mm Pitch, WLCSP Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
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therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC009Ak.pdf
Product-Specific Dimensions
Product
D
FAN48610UC50X
FAN48610BUC50X
1.215 ±0.030 mm
1.215 ±0.030 mm
E
1.215 ±0.030 mm
1.215 ±0.030 mm
X
0.02075 mm
0.02075 mm
Y
0.02075 mm
0.02075 mm
© 2013 Fairchild Semiconductor Corporation
FAN48610 • Rev. 1.0.0 •
11
www.fairchildsemi.com