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FAN2558MP12X View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FAN2558MP12X
Fairchild
Fairchild Semiconductor Fairchild
FAN2558MP12X Datasheet PDF : 15 Pages
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FAN2558/FAN2559
PRODUCT SPECIFICATIONS
General PCB Layout Considerations
For optimum device performance, careful circuit layout and
grounding techniques must be used. Establishing a small
local ground, to which the GND pin, and the output and
bypass capacitors are connected, is recommended. The input
capacitor should be grounded to the main ground plane. The
quiet local ground is then routed back to the main ground
plane using feed through via. In general, the high-frequency
compensation components (input, bypass, and output capaci-
tors) should be located as close to the device as possible.
Close proximity of the output capacitor is especially impor-
tant to achieve optimum performance, especially during high
load conditions. A large copper area in the local ground
serves as heat sink (as discussed above) when high power
dissipation signicantly increases device temperature. Com-
ponent-side copper provides signicantly better thermal per-
formance. Added feed through connecting the device side
ground plane to the back plane further reduces thermal resis-
tance.
8
REV. 1.0.4 3/15/04
 

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