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FAN2558S12X View Datasheet(PDF) - Fairchild Semiconductor

Part NameDescriptionManufacturer
FAN2558S12X 180mA Low Voltage CMOS LDO Fairchild
Fairchild Semiconductor Fairchild
FAN2558S12X Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
PRODUCT SPECIFICATIONS
Absolute Maximum Ratings
Parameter
VIN to GND
Voltage on any other pin to GND
Junction Temperature (TJ)
Storage Temperature
Lead Soldering Temperature, 10 seconds
Power Dissipation (PD)
Electrostatic Discharge (ESD) Protection (Note1)
FAN2558/FAN2559
HBM
CDM
Min.
-0.3
-55
-65
4
1
Max.
6
VIN + 0.3
150
150
300
Internally
Limited
Units
V
V
°C
°C
°C
W
kV
Recommended Operating Conditions
Parameter
Min.
Supply Voltage Range, VIN for VOUT < 2.0V
Supply Voltage Range, VIN for VOUT 2.0V
Load Current
2.7
VOUT + VDROPOUT
Enable Input Voltage VEN
0
Power Good Output Voltage Range VPG
0
Junction Temperature
-40
Thermal Resistance-Junction to Ambient SOT-23 (Note 2)
Thermal Resistance-Junction to Case, 2mm x 2mm
6-lead MLP
Typ.
Max.
5.5
5.5
180
VIN
VIN
125
235
75
Units
V
V
mA
V
V
°C
°C/W
Notes:
1. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charge Device Model)
2. Junction to ambient thermal resistance, ΘJC, is a strong function of PCB material, board thickness, thickness and number of
copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.
REV. 1.0.4 3/15/04
3
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