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FAN1587AT15 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FAN1587AT15
Fairchild
Fairchild Semiconductor Fairchild
FAN1587AT15 Datasheet PDF : 14 Pages
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FAN1587A
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die. This
is the lowest resistance path for heat flow. Proper mounting
ensures the best thermal flow from this area of the package to
the heat sink. Use of a thermally conductive material at the
PRODUCT SPECIFICATION
case-to-heat sink interface is recommended. Use a thermally
conductive spacer if the case of the device must be electri-
cally isolated and include its contribution to the total thermal
resistance. The cases of the FAN1587A series are directly
connected to the output of the device.
VIN
12V
C1
22µF
U1
FAN1587A
VIN
VOUT
+
ADJ
+
C2
100µF
R1
124
R2
768
VOUT
9V
+
C3
100µF
65-1587-18
Figure 15. Application Circuit (FAN1587A)
Table 1. Bill of Materials for Application Circuit for the FAN1587A
Item
Quantity
Manufacturer
Part Number
Description
C1
1
Xicon
L16V22
22µF, 16V Aluminum
C2, C3
2
Xicon
L10V100
100µF, 10V Aluminum
R1
1
Generic
R2
1
Generic
124, 1%
768, 1%
U1
1
Fairchild
FAN1587AT
3A Regulator
9
REV. 1.0.5 11/10/03
 

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