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FAN1585ADX Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza
componentes Descripción
fabricante
FAN1585ADX
Fairchild
Fairchild Semiconductor Fairchild
FAN1585ADX Datasheet PDF : 13 Pages
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FAN1585A
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die. This
is the lowest resistance path for heat flow. Proper mounting
ensures the best thermal flow from this area of the package to
the heat sink. Use of a thermally conductive material at the
PRODUCT SPECIFICATION
case-to-heat sink interface is recommended. Use a thermally
conductive spacer if the case of the device must be electri-
cally isolated and include its contribution to the total thermal
resistance. The cases of the FAN1585A series are directly
connected to the output of the device.
VIN
3.3V
C1
22µF
U1
FAN1585A
VIN
VOUT
+
ADJ
+
C2
100µF
R1
124
VOUT
1.5V
+
C3
100µF
R2
24.9
Figure 14. Application Circuit (FAN1585A)
Table 1. Bill of Materials for Application Circuit for the FAN1585A
Item
Quantity
Manufacturer
Part Number
Description
C1
1
Xicon
L10V22
22µF, 10V Aluminum
C2, C3
2
Xicon
L10V100
100µF, 10V Aluminum
R1
1
Generic
124, 1%
R2
1
Generic
24.9, 1%
U1
1
Fairchild
FAN1585AT
5A Regulator
U1
FAN1585A-1.5
VIN
3.3V
VIN
VOUT
+
C1
GND
22µF
VOUT
1.5V
+
C3
100µF
Figure 15. Application Circuit (FAN1585A-1.5)
Table 2. Bill of Materials for Application Circuit for the FAN1585A-1.5
Item
Quantity
Manufacturer
Part Number
Description
C1
1
Xicon
L10V22
22µF, 10V Aluminum
C3
1
Xicon
L10V100
100µF, 10V Aluminum
U1
1
Fairchild
FAN1585AT-1.5 5A Regulator
8
REV. 1.1.6 7/8/05
 

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