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FAN1582PX View Datasheet(PDF) - Fairchild Semiconductor

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FAN1582PX Datasheet PDF : 12 Pages
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PRODUCT SPECIFICATION
FAN1582
istics section provides a separate thermal resistance and
maximum junction temperature for both the control circuitry
and the power transistor. Calculate the maximum junction
temperature for both sections to ensure that both thermal
limits are met.
For example, look at using an FAN1582M-1.5 to generate
3A @ 1.5V ± 2% from a 3.3V source (3.2V to 3.6V).
Assumptions:
• Vin = 3.6V worst case
• VOUT = 1.47V worst case
• IOUT = 3A continuous
• TA = 70°C
Θ Case-to-Ambient = 5°C/W (assuming both a heatsink and a
thermally conductive material)
The power dissipation in this application is:
PD = (VIN - VOUT) * (IOUT) = (3.6-1.47) * (3) = 6.39W
From the specification table,
TJ = TA + (PD) * (Θ Case-to-Ambient + ΘJC)
= 70 + (6.39) * (5 + 3) = 121°C
The junction temperature is below the maximum rating.
Junction-to-case thermal resistance is specified from the IC
junction to the bottom of the case directly below the die. This
is the lowest resistance path for heat flow. Proper mounting
ensures the best thermal flow from this area of the package to
the heat sink. Use of a thermally conductive material at the
case-to-heat sink interface is recommended. Use a thermally
conductive spacer if the case of the device must be electri-
cally isolated and include its contribution to the total thermal
resistance.
VIN = 3.3V
10µF
VCNTL = 5V
U1
+
C1
VIN
VSENSE
FAN1582
VOUT
VCNTL
1µF
Adj
R1
C4
10µF
R2
C3
124
86.6
2.1V at 3A
+
100µF
C2
Figure 3. Application Circuit (FAN1582)
Table 1. Bill of Materials for Application Circuit for the FAN1582
Item
C1, C3
C2
C4
R1
R2
U1
Quantity
2
1
1
1
1
1
Manufacturer
Xicon
Xicon
Any
Generic
Generic
Fairchild
Part Number
L10V10
L10V100
FAN1582P
Description
10µF, 10V Aluminum
100µF, 10V Aluminum
1µF Ceramic
124, 1%
86.6, 1%
3A Regulator
REV. 1.1.2 2/26/03
7
 

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