datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

DM74LS123NX View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
DM74LS123NX Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Operating Rules (Continued)
8. Output pulse width variation versus VCC and tempera-
tures: Figure 6 depicts the relationship between pulse
width variation versus VCC, and Figure 7 depicts pulse
width variation versus temperatures.
FIGURE 6.
9. Under any operating condition CX and RX must be kept
as close to the one-shot device pins as possible to min-
imize stray capacitance, to reduce noise pick-up, and
to reduce I-R and Ldi/dt voltage developed along their
connecting paths. If the lead length from CX to pins (6)
and (7) or pins (14) and (15) is greater than 3 cm, for
example, the output pulse width might be quite different
from values predicted from the appropriate equations.
A non-inductive and low capacitive path is necessary to
ensure complete discharge of CX in each cycle of its
operation so that the output pulse width will be accu-
rate.
10. The CEXT pins of this device are internally connected to
the internal ground. For optimum system performance
they should be hard wired to the systems return
ground plane.
11. VCC and ground wiring should conform to good high-
frequency standards and practices so that switching
transients on the VCC and ground return leads do not
cause interaction between one-shots. A 0.01 µF to 0.10
µF bypass capacitor (disk ceramic or monolithic type)
from VCC to ground is necessary on each device. Fur-
thermore, the bypass capacitor should be located as
close to the VCC-pin as space permits.
Note: For further detailed device characteristics and output per-
formance please refer to the Fairchild Semiconductor one-shot
application note AN-372.
FIGURE 7.
3
www.fairchildsemi.com
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]