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DAC1627D1G25 View Datasheet(PDF) - NXP Semiconductors.

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DAC1627D1G25 Datasheet PDF : 69 Pages
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NXP Semiconductors
DAC1627D1G25
Dual 16-bit DAC: up to 1.25 Gsps; x2, x4 and x8 interpolating
Table 5. Characteristics …continued
VDDA(1V8) = 1.8 V; VDDD(1V8) = 1.8 V; VDDA(3V3) = 3.3 V; Typical values measured at Tamb = +25 °C; RL = 50 Ω; IO(fs) = 20 mA;
maximum sample rate used; external PLL; no auxiliary DAC; no inverse sinus x/x; no output correction; output load condition
defined in Figure 22; output level = 1 V (p-p).
Symbol
Parameter
Conditions
Test Min
Typ
[1]
Max
Unit
ACPR
NSD
adjacent channel fs = 1228.8 Msps;
power ratio
×4 interpolation;
fo = 210 MHz
1 carrier; BW = 5 MHz
D
-
2 carriers; BW = 10 MHz D
-
4 carriers; BW = 20 MHz D
-
noise spectral
density
fs = 983.04 Msps;
×4 interpolation;
D
-
fo = 20 MHz at 1 dBFS
fs = 983.04 Msps;
×4 interpolation;
D
-
fo = 153.6 MHz at 1 dBFS
77
-
73
-
72
-
-164
-
-161
-
dBc
dBc
dBc
dBm/Hz
dBm/Hz
[1] D = guaranteed by design; C = guaranteed by characterization; I = 100 % industrially tested.
[2] VDDA(1V8)_D, VDDA(1V8)_P1 and VDDA(1V8)_P2 must be connected to the same 1.8 V analog power supply. it is recommended to use
dedicated filters for the three power pins.
[3] |Vgpd| represents the ground potential difference voltage. This voltage is the result of current flowing through the finite resistance and the
inductance between the receiver and the driver circuit ground voltages.
10. Application information
10.1 General description
The DAC1627D1G25 is a dual 16-bit DAC operating up to 1250 Msps. Each DAC consists
of a segmented architecture, comprising a 6-bit thermometer sub-DAC and a 10-bit binary
weighted sub-DAC.
A maximum input LVDS DDR data rate of up to 312.5 MHz and a maximum output
sampling rate of 1250 Msps ensure more flexibility for wide bandwidth and multi-carrier
systems. The internal 40-bit NCO of the DAC1627D1G25 simplifies the frequency
selection of the system. The DAC1627D1G25 provides ×2, ×4 or ×8 interpolation filters
that are very useful for removing the undesired images.
Each DAC generates two complementary current outputs on pins IOUTAP and IOUTAN
and pins IOUTBP and IOUTBN. These outputs provide a full-scale output current (IO(fs)) of
up to 31.8 mA. An internal reference is available for the reference current which is
externally adjustable using pin VIRES.
High resolution internal gain, phase and offset control provide outstanding image and
Local Oscillator (LO) signal rejection at the system analog modulator output.
Multiple device synchronization enables synchronization of the outputs of multiple DAC
devices. MDS guarantees a maximum skew of one output clock period between several
devices.
All functions can be set using an SPI interface.
DAC1627D1G25
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2011
© NXP B.V. 2011. All rights reserved.
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