FC80960HT75SL2GT View Datasheet(PDF) - Intel
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Description
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FC80960HT75SL2GT Datasheet PDF : 102 Pages
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80960HA/HD/HT
Table 14. Maximum TA at Various Airflows in °C (PQ4 Package Only)
Airflow-ft/min (m/sec)
fCLKIN
0
200
400
600
800
(MHz)
(0)
(1.01)
(2.03)
(3.04)
(4.06)
Core
TA with
Heatsink*
25
33
40
71
67
63
76
74
71
79
77
75
79
77
75
80
79
77
1X Bus
Clock
TA
25
70
73
75
75
76
without
33
65
68
72
72
74
Heatsink
40
61
65
69
69
71
16
71
76
79
79
80
TA with
25
62
71
75
75
77
Heatsink*
33
55
66
71
71
74
Core
40
48
62
68
68
72
2X Bus
Clock
TA
without
Heatsink
16
25
33
40
69
60
52
42
72
64
57
51
75
68
63
58
75
68
63
58
76
71
66
62
TA with
20
58
68
73
73
76
Core
Heatsink*
25
51
64
70
70
73
3X Bus
Clock
TA
without
Heatsink
20
25
56
48
61
55
66
61
66
61
68
64
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
1000
(5.07)
80
79
77
76
74
71
80
77
74
72
76
71
66
62
76
73
68
64
Table 15. 80960Hx 208-Pin PQ4 Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
200 400 600 800 1000
(0) (1.01) (2.03) (3.07) (4.06) (5.07)
θ Junction-to-Case
(Case measured as
1
1
1
1
1
1
shown in Figure 5)
θ Case-to-Ambient
(No Heatsink)
12
10
8
8
7
7
θ Case-to-Ambient
(With Heatsink)*
11
7
5
5
4
4
θJA
θJC
NOTES:
1. This table applies to 80960Hx PQ4 plugged into socket or soldered directly to board.
2. θJA = θJC + θCA
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Advance Information Datasheet
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