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FC80960HD66SL2GN View Datasheet(PDF) - Intel

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FC80960HD66SL2GN Datasheet PDF : 102 Pages
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80960HA/HD/HT
Table 12. Maximum TA at Various Airflows in °C (PGA Package Only)
Airflow-ft/min (m/sec)
Core
1X Bus
Clock
Core
2X Bus
Clock
Core
3X Bus
Clock
fCLKIN
0
200
400
600
800
1000
(MHz)
(0)
(1.01)
(2.03)
(3.04)
(4.06)
(5.07)
TA with
Heatsink*
25
33
40
69
63
59
74
70
67
78
75
73
79
77
75
80
79
77
80
79
77
TA
25
64
67
71
74
75
76
without
33
56
62
67
70
72
74
Heatsink
40
50
56
63
67
69
71
16
68
73
77
79
80
80
TA with
25
58
66
73
75
77
77
Heatsink*
33
49
60
69
71
74
74
40
41
55
65
68
72
72
TA
without
Heatsink
16
25
33
40
62
49
38
27
66
56
46
38
71
62
55
48
73
66
60
55
75
68
63
58
76
71
66
62
TA with
20
53
63
71
73
76
76
Heatsink*
25
45
58
67
70
73
73
TA
without
Heatsink
20
25
43
33
51
42
58
51
63
58
66
61
68
64
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 13. 80960Hx 168-Pin PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
200 400 600 800 1000
(0) (1.01) (2.03) (3.07) (4.06) (5.07)
θ Junction-to-Case
(Case measured as
1.5
1.5
1.5
1.5
1.5
1.5
shown in Figure 5)
θ Case-to-Ambient
(No Heatsink)
17
14
11
9
8
7
θ Case-to-Ambient
(With Heatsink)*
13
9
6
5
4
4
θJA
θJC
NOTES:
1. This table applies to 80960Hx PGA plugged into socket or soldered directly to board.
2. θJA = θJC + θCA
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
24
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