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CXP87352 View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
MFG CO.
CXP87352
Sony
Sony Semiconductor Sony
CXP87352 Datasheet PDF : 32 Pages
Package Outline
Unit: mm
100PIN QFP (PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
+ 0.1
0.15 – 0.05
CXP87352/87360
0.65
±0.12 M
0.15
A
+ 0.35
2.75 – 0.15
0° to 15°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-100P-L01
QFP100-P-1420-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE WEIGHT
COPPER / 42 ALLOY
1.4g
75
76
100PIN LQFP (PLASTIC)
16.0 ± 0.2
14.0 ± 0.1
51
50
100
1
0.5 ± 0.08
+ 0.08
0.18 – 0.03
0.1 ± 0.1
A
26 (0.22)
25
+ 0.2
1.5 – 0.1
+ 0.05
0.127 – 0.02
0.1
0° to 10°
NOTE: Dimension “” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
DETAIL A
LQFP-100P-L01
QFP100-P-1414-A
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
– 32 –
 

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