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CXA1779P View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
View to exact match
CXA1779P Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package Outline
Unit: mm
28PIN DIP (PLASTIC)
+ 0.4
37.8 – 0.1
28
15
1
14
2.54
CXA1779P
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.Center part is mirror surface.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-28P-03
DIP028-P-0600
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
4.2g
– 10 –
 

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