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CXA1211 View Datasheet(PDF) - Sony Semiconductor

Part NameDescriptionManufacturer
CXA1211 Electronic Volume Sony
Sony Semiconductor Sony
CXA1211 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package Outline
Unit: mm
8PIN SOP (PLASTIC)
+ 0.4
5.0 – 0.1
8
5
A
CXA1211M
+ 0.4
1.25 – 0.15
0.10
1
4
1.27
b
0.24 M
B
+ 0.15
0.1 – 0.1
+ 0.1
b = 0.4 – 0.05
(0.4)
b = 0.4 ± 0.03
0° to 10°
DETAILA
DETAIL B : SOLDER
DETAIL B : PALLADIUM
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-8P-L03
SOP008-P-0225
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
0.1g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 10 –
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