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CS8122YT5 View Datasheet(PDF) - ON Semiconductor

Part Name
Description
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CS8122YT5 Datasheet PDF : 10 Pages
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CS8122
HEAT SINKS
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA.
RqJA + RqJC ) RqCS ) RqSA
(3)
where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heatsink thermal resistance, and
RqSA = the heatsink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it too is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
ORDERING INFORMATION
CS8122YT5
Device
CS8122YT5G
CS8122YTVA5
CS8122YTVA5G
CS8122YTHA5
CS8122YTHA5G
Package
TO−220
STRAIGHT
TO−220
STRAIGHT
(Pb−Free)
TO−220
VERTICAL
TO−220
VERTICAL
(Pb−Free)
TO−220
HORIZONTAL
TO−220
HORIZONTAL
(Pb−Free)
Shipping
50 Units / Rail
http://onsemi.com
8
 

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