CS1615-FSZR View Datasheet(PDF) - Apex Microtechnology
Part Name
Description
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CS1615-FSZR Datasheet PDF : 16 Pages
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CS1615/16
3.2 Thermal Resistance
Symbol
Parameter
JA Junction-to-Ambient Thermal Impedance
JC Junction-to-Case Thermal Impedance
2 Layer PCB
4 Layer PCB
2 Layer PCB
4 Layer PCB
SOIC
119
105
50
44
TSSOP
138
103
44
28
Unit
°C / W
°C / W
°C / W
°C / W
3.3 Absolute Maximum Ratings
Characteristics conditions:
All voltages are measured with respect to GND.
Pin
14
2,8,9,
10,11,16
2,8,9,
10,11,16
13
13
5
3
-
-
-
All Pins
Symbol
VDD IC Supply Voltage
Parameter
Analog Input Maximum Voltage
Analog Input Maximum Current
VGD
IGD
ISOURCE
ICLAMP
PD
TJ
TStg
ESD
Gate Drive Output Voltage
Gate Drive Output Current
Current into Pin
Clamp Output Current
Total Power Dissipation
Junction Temperature Operating Range
Storage Temperature Range
Electrostatic Discharge Capability
Value
Unit
18.5
V
-0.5 to (VDD+0.5) V
5
mA
-0.3 to (VDD+0.3) V
-1.0 / +0.5
A
1.1
A
15
mA
400
mW
(Note 8) -40 to +125
°C
-65 to +150
°C
Human Body Model
2000
V
Charged Device Model
500
V
Note:
8. Long-term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation at
the rate of 50 mW /°C for variation over temperature.
WARNING:
Operation at or beyond these limits may result in permanent damage to the device.
Normal operation is not guaranteed at these extremes.
6
DS961F1
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