NXP Semiconductors
9. Package outline
Plastic surface-mounted package; 4 leads
BF1118(R); BF1118W(R)
Silicon RF switches
SOT143B
D
B
E
A
X
y
e
4
1
b1
e1
vM A
HE
bp
wM B
3
2
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
b1
c
D
E
e
e1
HE Lp
Q
v
w
y
mm
1.1
0.9
0.1 0.48 0.88 0.15 3.0
0.38 0.78 0.09 2.8
1.4
1.2
1.9
1.7
2.5
2.1
0.45 0.55
0.15 0.45
0.2
0.1
0.1
OUTLINE
VERSION
IEC
SOT143B
REFERENCES
JEDEC
JEITA
Fig 4. Package outline SOT143B
BF1118_1118R_1118W_1118WR
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 June 2010
EUROPEAN
PROJECTION
ISSUE DATE
04-11-16
06-03-16
© NXP B.V. 2010. All rights reserved.
6 of 13