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BCP53T1G View Datasheet(PDF) - ON Semiconductor

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Description
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BCP53T1G
ON-Semiconductor
ON Semiconductor ON-Semiconductor
BCP53T1G Datasheet PDF : 5 Pages
1 2 3 4 5
BCP53 Series
PNP Silicon
Epitaxial Transistors
This PNP Silicon Epitaxial transistor is designed for use in audio
amplifier applications. The device is housed in the SOT−223 package
which is designed for medium power surface mount applications.
High Current
NPN Complement is BCP56
The SOT−223 Package can be soldered using wave or reflow.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die
Device Marking:
BCP53T1G = AH
BCP53−10T1G = AH−10
BCP53−16T1G = AH−16
S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Total Power Dissipation
@ TA = 25°C (Note 1)
Derate above 25°C
VCEO
VCBO
VEBO
IC
PD
−80
−100
−5.0
1.5
1.5
12
Vdc
Vdc
Vdc
Adc
W
mW/°C
Operating and Storage
Temperature Range
TJ, Tstg −65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max
Thermal Resistance, Junction−to−Ambient
RqJA
83.3
(Surface Mounted)
Lead Temperature for Soldering,
0.0625from case
Time in Solder Bath
TL
260
10
Unit
°C/W
°C
s
www.onsemi.com
MEDIUM POWER HIGH
CURRENT SURFACE MOUNT
PNP TRANSISTORS
COLLECTOR 2, 4
1
BASE
EMITTER 3
MARKING DIAGRAM
4
12 3
SOT−223
CASE 318E
STYLE 1
AYW
XXXXXG
G
1
A
= Assembly Location
Y
= Year
W
= Work Week
XXXXX = Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
BCP53T1G
SBCP53−10T1G
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
1000/Tape & Reel
1000/Tape & Reel
BCP53−10T1G
SOT−223 1000/Tape & Reel
(Pb−Free)
SBCP53−10T1G SOT−223 1000/Tape & Reel
(Pb−Free)
BCP53−16T1G
SBCP53−16T1G
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
1000/Tape & Reel
1000/Tape & Reel
BCP53−16T3G
SOT−223 4000/Tape & Reel
(Pb−Free)
NSVBCP53−16T3G SOT−223 4000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
June, 2018 − Rev. 13
Publication Order Number:
BCP53T1/D
 

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