ES1C-TP View Datasheet(PDF) - Micro Commercial Components
Part Name
Description
View to exact match
ES1C-TP Datasheet PDF : 4 Pages
| |||
NOT RECOMMENDED FOR NEW DESIGNS
USE ES1A-LTP~ES1J-LTP SERIES
MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
Features
• Halogen free available upon request by adding suffix "-HF"
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
x High Temp Soldering: 260qC for 10 Seconds At Terminals
x Superfast Recovery Times For High Efficiency
Maximum Ratings
x Operating Temperature: -50qC to +150qC
x Storage Temperature: -50qC to +150qC
x Maximum Thermal Resistance; 15qC/W Junction To Lead
MCC
Maximum Maximum Maximum
Part
Number
Device
Recurrent
Marking Peak Reverse
Voltage
RMS
Voltage
DC
Blocking
Voltage
ES1A
ES1A
50V
35V
50V
ES1B
ES1B
100V
70V
100V
ES1C
ES1C
150V
105V
150V
ES1D
ES1D
200V
140V
200V
ES1G
ES1G
400V
280V
400V
ES1J
ES1J
600V
420V
600V
ES1K
ES1K
800V
560V
800V
ES1M
ES1M
1000V
700V
1000V
Electrical Characteristics @ 25qC Unless Otherwise Specified
Average Forward
Current
IF(AV)
1.0A Ta = 75qC
Peak Forward Surge
IFSM
Current
30A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
ES1A-D
VF
ES1G-J
ES1K~M
.975V IFM = 1.0A;
1.35V TJ = 25qC*
1.70V
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR
5PA TJ = 25qC
100PA TJ = 100qC
Maximum Reverse
Recovery Time
ES1A-D
Trr
ES1G-K
ES1M
50ns
75ns
100ns
IF=0.5A, IR=1.0A,
Irr=0.25A
Typical Junction
CJ
45pF Measured at
Capacitance
1.0MHz, VR=4.0V
*Pulse test: Pulse width 200 Psec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
ES1A
THRU
ES1M
1 Amp Ultra Fast
Recovery
Silicon Rectifier
50 to 1000 Volts
DO-214AC
(HSMA) (High Profile)
H
Cathode Band
J
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.067
.089
C
.002
.008
D
---
.02
E
.035
.055
F
.065
.096
G
.205
.224
H
.160
.180
J
.100
.112
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
B
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
Revision: C
www.mccsemi.com
1 of 4
2013/01/01
|
|
Share Link: 