BAS70-06W View Datasheet(PDF) - NXP Semiconductors.
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BAS70-06W Datasheet PDF : 20 Pages
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NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Conditions
Per device
Rth(j-a)
thermal resistance from in free air
junction to ambient
SOT23
SOT143B
SOT363 (BAS70-07S)
SOT666 (BAS70VV)
SOT666 (BAS70-07V)
SOD123F
SOD323
SOD523
SOD882
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
SOT363 (BAS70XY)
Min Typ Max Unit
[1]
-
-
500 K/W
-
-
500 K/W
-
-
416 K/W
[2] -
-
700 K/W
[2] -
-
416 K/W
[2] -
-
330 K/W
-
-
450 K/W
[2] -
-
450 K/W
[2] -
-
500 K/W
-
-
625 K/W
[3] -
-
260 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Per diode
VF
forward voltage
IF = 1 mA
IF = 10 mA
IF = 15 mA
IR
reverse current
VR = 50 V
VR = 70 V
Cd
diode capacitance VR = 0 V; f = 1 MHz
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
Min Typ Max Unit
[1]
-
-
410 mV
-
-
750 mV
-
-
1
V
-
-
100 nA
-
-
10 μA
-
-
2
pF
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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