BAJ5CC0FP View Datasheet(PDF) - ROHM Semiconductor
Part Name
Description
View to exact match
BAJ5CC0FP Datasheet PDF : 23 Pages
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BAxxDD0xx BAxxCC0xx
●I/O equivalence circuit
<BAxxDD0xx Series>
Vcc
39kΩ 2kΩ
CTL
31kΩ
Vcc
10kΩ
R2
R1
Fig.27
Datasheet
<BAxxCC0xx Series>
Vcc
OUT
25kΩ
CTL
25kΩ
10kΩ
R2
OUT
R1
Fig.28
●Power Dissipation
HRP-5
10
Board size : 70×70×1.6 ㎜ 3 (board contains a thermal via)
9
Board front copper foil area : 10.5×10.5 ㎜ 2
①2-layer board (back surface copper foil area :15×15 ㎜ 2)
②2-layer board (back surface copper foil area :70×70 ㎜ 2)
8 ③4-layer board (back surface copper foil area :70×70 ㎜ 2)
7
③7.3W
6
5
②5.5W
4
3
2
①2.3W
1
0
0
25
50
75
100 125 150
Ambient temperature:Ta(℃）
Fig.29
TO252-5
2.0
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
1.6 TO252-5θja=96.2(℃/W)
1.30
1.2
0.8
0.4
0.0
0
25
50
75 100 125 150
Ambient temperature:Ta(℃）
Fig.31
TO220FP-5
25
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-6=62.5(℃/W)
20
(1)20.0
15
10
5
(2)2.0
0
0
25
50
75
100 125 150
Ambient temperature:Ta(℃）
Fig.30
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TSZ22111･15･001
13/20
TSZ02201-0R6R0A600130-1-2
26.Jun.2012 Rev.001
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