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BA3950A View Datasheet(PDF) - ROHM Semiconductor

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Description
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BA3950A Datasheet PDF : 8 Pages
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Regulator ICs
(4) Overcurrent protection circuit
An overcurrent protection circuit is installed in each out-
put system, based on the respective output current. This
prevents IC destruction by overcurrent, by limiting the
current with a curve shape of “7” in the voltage-current
graph. The IC is designed with margins so that current
flow will be restricted and latching will be prevented even
if a large current suddenly flows through a large capaci-
tor. Note that these protection circuits are only good for
preventing damage from sudden accidents. Make sure
your design does not cause the protection circuit to oper-
ate continuously under transitional conditions (for
instance, when output is clamped at 1VF or higher). Note
that the circuit ability is negatively correlated with temper-
ature.
FThermal derating curve
BA3950A
(5) Thermal protection circuit
A built-in thermal protection circuit prevents thermal
damage to the IC. All outputs are switched OFF when the
circuit operates, and revert to the original state when
temperature drops to a certain level.
(6) Improving ripple rejection by capacitors
Ripple rejection of the CDP and MAIN outputs can be im-
proved by installing a capacitor that reduces the AC gain.
(7) Malfunction in intense electric fields
Note that bringing the IC into an intense electric field
(such as a radio relay station) may result in malfunction.
Estimate of allowable power dissipation (PMAX.)
S Power consumed by CDP
S Power consumed by µ-COM
S Power consumed by MAIN
S Power consumed internally by each circuit
P1 = (VCC * CDP) maximum load current of CDP
P2 = {VCC * (µ-COM)} maximum load current of µ-COM
P3 = (VCC * MAIN) maximum load current of MAIN
P4 = VCC supply current
PMAX. = P1 ) P2 ) P3 ) P4
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