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B1019 View Datasheet(PDF) - Unspecified

Part Name
Description
View to exact match
B1019
ETC1
Unspecified ETC1
B1019 Datasheet PDF : 24 Pages
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3 Melt the solder.
• Apply the nozzle to the soldered
part and melt the solder.
CAUTION
Never allow the nozzle to touch the
board itself.
• Confirm that the solder is melted.
CAUTION
To confirm that all solder is melted,
observe the inside of the hole and
the backside of the P.W.B. If this is
difficult to do, try slowly moving the
lead with the nozzle – If the lead
moves, the solder is melted.
CAUTION
Never move the lead by force. If it
doesnʼt move easily, the solder isnʼt
yet fully melted.
4 Absorb the solder.
• After confirming that the solder
is completely melted, absorb the
solder by squeezing the trigger on
the gun.
CAUTION
Never leave any solder remaining
inside the hole in the P.W.B.
• After fully absorbing all the solder,
cool the soldering junction in
order to prevent it from becoming
resoldered.
5 Problems during
desoldering.
• If solder remains, resolder the
component and repeat the desol-
dering process.
Nozzle
P.W.B.
Solder
Lead
Slowly move
the lead with
the nozzle.
Absorb the solder by slowly
moving the lead back and
forth with the tip of the
nozzle.
8
 

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