L7583B View Datasheet(PDF) - Agere -> LSI Corporation

Part Name

Description

View to exact match

L7583B

Line Card Access Switch

Agere -> LSI Corporation 

Data Sheet

February 2001

L7583A/B/C/D Line Card Access Switch

Pin Information (continued)

Table 1. Pin Descriptions

DIP SOG Symbol

Description

DIP SOG Symbol

Description

1 1 FGND Fault ground.

24 28

VBAT Battery voltage. Used as a ref-

erence for protection circuit.

22

NC No connection.

23 27, 26 NC No connection.

3 3, 4 NC No connection.

22 25, 21 NC No connection.

4 5 TTESTin Test (in) access on TIP.

21 24 RTESTin Test (in) access on RING.

56

TBAT Connect to TIP on SLIC side.

20 23

RBAT Connect to RING on SLIC

side.

6 7 TLINE Connect to TIP on line side.

19 22

RLINE Connect to RING on line side.

7 8 TRINGING Connect to return ground for ring- 18 20 RRINGING Connect to ringing generator.

ing generator.

8 10 TTESTout Test (out) access on TIP.

17 19 RTESTout Test (out) access on RING.

9 9, 11 NC No connection.

16 18 LATCH Data input control, active-high,

transparent low.

10 12 VDD 5 V supply.

15 17 INTESTin Logic level switch input control.

11 13

TSD Temperature shutdown pin. Can 14 16

be used as a logic level input or an

output. See Tables 16 and 17,

Truth Tables, and the Switching

Behavior section of this data sheet

for input pin description. As an

output flag, will read 5 V when the

device is in its operational mode

and 0 V in the thermal shutdown

mode. To disable the thermal shut-

down mechanism, tie this pin to

5 V (not recommended).

INRING Logic level switch input control.

12 14 DGND Digital ground.

13 15 INTESTout Logic level switch input control.

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Operating Temperature Range

Storage Temperature Range

Relative Humidity Range

Pin Soldering Temperature (t = 10 s max)

5 V Power Supply

Battery Supply

Logic Input Voltage

Input-to-output Isolation

Pole-to-pole Isolation

Min

Max

Unit

–40

110

°C

–40

150

°C

5

95

%

—

260

°C

—

7

V

—

–85

V

—

7

V

—

330

V

—

330

V

Lucent Technologies Inc.

3

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