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L128MH103N View Datasheet(PDF) - Advanced Micro Devices

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L128MH103N Datasheet PDF : 66 Pages
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DATA SHEET
TABLE OF CONTENTS
Continuity of Specifications ............................................................. i
For More Information ....................................................................... i
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 11
Table 1. Device Bus Operations ...........................................................11
Word/Byte Configuration ........................................................ 11
VersatileIO(VIO) Control ........................................................... 11
Requirements for Reading Array Data ......................................... 12
Page Mode Read .................................................................... 12
Writing Commands/Command Sequences .................................. 12
Write Buffer ............................................................................. 12
Accelerated Program Operation ............................................. 12
Autoselect Functions .............................................................. 12
Standby Mode ........................................................................ 12
Automatic Sleep Mode ................................................................. 13
RESET#: Hardware Reset Pin ..................................................... 13
Output Disable Mode ................................................................... 13
Table 2. Sector Address Table ..............................................................14
Autoselect Mode..................................................................... 20
Table 3. Autoselect Codes, (High Voltage Method) .............................20
Sector Group Protection and Unprotection .................................. 21
Table 4. Sector Group Protection/Unprotection Address Table .....21
Write Protect (WP#)................................................................ 22
Temporary Sector Group Unprotect ............................................. 22
Figure 1. Temporary Sector Group Unprotect Operation................ 22
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 23
Secured Silicon Sector Flash Memory Region ............................. 24
Table 5. Secured Silicon Sector Contents ......................................24
Figure 3. Secured Silicon Sector Protect Verify .............................. 25
Hardware Data Protection ............................................................ 25
Low VCC Write Inhibit ............................................................ 25
Write Pulse “Glitch” Protection ............................................... 25
Logical Inhibit .......................................................................... 25
Power-Up Write Inhibit ............................................................ 25
Common Flash Memory Interface (CFI) . . . . . . . 25
Table 6. CFI Query Identification String .............................. 26
Table 7. System Interface String......................................................26
Table 8. Device Geometry Definition................................... 27
Table 9. Primary Vendor-Specific Extended Query............. 28
Command Definitions . . . . . . . . . . . . . . . . . . . . . 29
Reading Array Data ...................................................................... 29
Reset Command .......................................................................... 29
Autoselect Command Sequence .................................................. 29
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence ................................................................... 30
Word Program Command Sequence ........................................... 30
Unlock Bypass Command Sequence ..................................... 30
Write Buffer Programming ...................................................... 30
Accelerated Program .............................................................. 31
Figure 4. Write Buffer Programming Operation............................... 32
Figure 5. Program Operation .......................................................... 33
Program Suspend/Program Resume Command Sequence ........ 33
Figure 6. Program Suspend/Program Resume............................... 34
Chip Erase Command Sequence ................................................. 34
Sector Erase Command Sequence .............................................. 34
Erase Suspend/Erase Resume Commands ................................ 35
Figure 7. Erase Operation.............................................................. 36
Command Definitions ............................................................. 37
Table 10. Command Definitions (x16 Mode, BYTE# = VIH) ................. 37
Table 11. Command Definitions (x8 Mode, BYTE# = VIL) ................... 38
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 39
DQ7: Data# Polling ...................................................................... 39
Figure 8. Data# Polling Algorithm .................................................. 39
RY/BY#: Ready/Busy#............................................................ 40
DQ6: Toggle Bit I .......................................................................... 40
Figure 9. Toggle Bit Algorithm........................................................ 41
DQ2: Toggle Bit II ......................................................................... 41
Reading Toggle Bits DQ6/DQ2 .................................................... 41
DQ5: Exceeded Timing Limits ...................................................... 42
DQ3: Sector Erase Timer ............................................................. 42
DQ1: Write-to-Buffer Abort ........................................................... 42
Table 12. Write Operation Status ......................................................... 43
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 44
Figure 10. Maximum Negative Overshoot Waveform ................... 44
Figure 11. Maximum Positive Overshoot Waveform..................... 44
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 44
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 12. Test Setup.................................................................... 46
Table 13. Test Specifications ......................................................... 46
Key to Switching Waveforms. . . . . . . . . . . . . . . . 46
Figure 13. Input Waveforms and Measurement Levels ................. 46
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 47
Read-Only Operations ........................................................... 47
Figure 14. Read Operation Timings ............................................... 47
Figure 15. Page Read Timings ...................................................... 48
Hardware Reset (RESET#) .................................................... 49
Figure 16. Reset Timings ............................................................... 49
Erase and Program Operations .............................................. 50
Figure 17. Reset Timings ............................................................... 51
Figure 18. Program Operation Timings.......................................... 52
Figure 19. Accelerated Program Timing Diagram.......................... 52
Figure 20. Chip/Sector Erase Operation Timings .......................... 53
Figure 21. Data# Polling Timings (During Embedded Algorithms). 54
Figure 22. Toggle Bit Timings (During Embedded Algorithms)...... 55
Figure 23. DQ2 vs. DQ6................................................................. 55
Temporary Sector Group Unprotect ....................................... 56
Figure 24. Temporary Sector Group Unprotect Timing Diagram ... 56
Figure 25. Sector Group Protect and Unprotect Timing Diagram .. 57
Alternate CE# Controlled Erase and Program Operations ..... 58
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings.......................................................................... 59
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 59
Erase And Programming Performance. . . . . . . . 60
TSOP Pin and BGA Package Capacitance . . . . . 61
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 62
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline
Package (TSOP) ..................................................................... 62
LAA064—64-Ball Fortified Ball Grid Array
13 x 11 mm Package .............................................................. 63
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 64
January 31, 2007 25270C7
Am29LV128MH/L
5
 

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