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ADV7390BCPZ View Datasheet(PDF) - Analog Devices

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ADV7390BCPZ Datasheet PDF : 108 Pages
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ADV7390/ADV7391/ADV7392/ADV7393
ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter1
VAA to AGND
VDD to DGND
PVDD to PGND
VDD_IO to GND_IO
AGND to DGND
AGND to PGND
AGND to GND_IO
DGND to PGND
DGND to GND_IO
PGND to GND_IO
Digital Input Voltage to GND_IO
Analog Outputs to AGND
Max CLKIN Input Frequency
Storage Temperature Range (tS)
Junction Temperature (tJ)
Lead Temperature (Soldering, 10 sec)
Rating
−0.3 V to +3.9 V
−0.3 V to +2.3 V
−0.3 V to +2.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to VDD_IO + 0.3 V
−0.3 V to VAA
80 MHz
−60°C to +100°C
150°C
260°C
1 Analog output short circuit to any power supply or common can be of an
indefinite duration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance1
Package Type
θJA2
θJC-TOP3
30-Ball WLCSP
35 1
32-Lead LFCSP
27 32
40-Lead LFCSP
26 32
θJC-BOTTOM4
N/A
1.2
1
Unit
°C/W
°C/W
°C/W
1 Values are based on a JEDEC 4-layer test board.
2 With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
3 This is the thermal resistance of the junction to the top of the package.
4 This is the thermal resistance of the junction to the bottom of the package.
The ADV739x is an RoHS-compliant, Pb-free product. The lead
finish is 100% pure Sn electroplate. The device is suitable for Pb-
free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20).
The ADV739x is backward compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be soldered
with SnPb solder pastes at conventional reflow temperatures of
220°C to 235°C.
ESD CAUTION
Rev. G | Page 18 of 108
 

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