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ADV7181DWBCPZ View Datasheet(PDF) - Analog Devices

Part NameDescriptionManufacturer
ADV7181DWBCPZ 10-Bit, 10-Channel, Multiformat SDTV/HDTV Video Decoder and RGB Graphics Digitizer ADI
Analog Devices ADI
ADV7181DWBCPZ Datasheet PDF : 24 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD to GND
DVDD to GND
PVDD to GND
DVDDIO to GND
DVDDIO to AVDD
PVDD to DVDD
DVDDIO to PVDD
DVDDIO to DVDD
AVDD to PVDD
AVDD to DVDD
Digital Inputs to GND
Digital Outputs to GND
Analog Inputs to GND
Operating Temperature Range
Maximum Junction Temperature (TJ MAX)
Storage Temperature Range
Infrared Reflow, Soldering (20 sec)
Rating
4V
2.2 V
2.2 V
4V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +2 V
−0.3 V to +2 V
−0.3 V to +2 V
−0.3 V to +2 V
GND − 0.3 V to
DVDDIO + 0.3 V
GND − 0.3 V to
DVDDIO + 0.3 V
GND − 0.3 V to
AVDD + 0.3 V
−40°C to +85°C
125°C
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
REFLOW SOLDER
The ADV7181D is a Pb-free, environmentally friendly product.
It is manufactured using the most up-to-date materials and pro-
cesses. The coating on the leads of each device is 100% pure Sn
electroplate. The device is suitable for Pb-free applications and
can withstand surface-mount soldering at up to 255°C ± 5°C.
In addition, the ADV7181D is backward-compatible with
conventional SnPb soldering processes. This means that the
electroplated Sn coating can be soldered with Sn/Pb solder
pastes at conventional reflow temperatures of 220°C to 235°C.
ADV7181D
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the part, turn off any
unused ADCs.
It is imperative that the recommended scripts be used for the
following high current modes: SCART, 720p, 1080i, and all
RGB graphic standards. Using the recommended scripts ensures
correct thermal performance. These scripts are available from
a local field applications engineer (FAE).
The junction temperature must always stay below the maximum
junction temperature (TJ MAX) of 125°C. The junction temperature
can be calculated by
TJ = TA MAX + (θJA × WMAX)
where:
TA MAX = 85°C.
θJA = 20.3°C/W.
WMAX = ((AVDD × IAVDD) + (DVDD × IDVDD) +
(DVDDIO × IDVDDIO) + (PVDD × IPVDD))
THERMAL RESISTANCE
Table 6 specifies the typical values for the junction-to-ambient
thermal resistance (θJA) and the junction-to-case thermal resis-
tance (θJC) for an ADV7181D soldered on a 4-layer PCB with
solid ground plane.
Table 6. Thermal Resistance
Package Type
θJA1
θJC
64-Lead LFCSP (CP-64-3)
20.3
1.2
1 In still air.
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 9 of 24
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