ABSOLUTE MAXIMUM RATINGS
VAA to GND
Voltage on Any Digital Input Pin
Storage Temperature (TS)
Junction Temperature (TJ)
Lead Temperature (Soldering, 10 sec)
Analog Outputs to GND1
GND − 0.5 V to VAA + 0.5 V
−65°C to +150°C
GND − 0.5 V to VAA
1 Analog output short circuit to any power supply or GND can be of an
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability. Only one absolute maximum rating may
be applied at any one time.
PACKAGE THERMAL PERFORMANCE
The 44-MQFP package used for this device takes advantage of
an ADI patented thermal coastline lead frame construction.
This maximizes heat transfer into the leads and reduces the
package thermal resistance.
For the MQFP package, the junction-to-ambient (θJA) thermal
resistance in still air on a four-layer PCB is 35.5°C/W. The
junction-to-case thermal resistance (θJC) is 13.75°C/W. For the
TQFP package, θJA in still air on a four-layer PCB is 53.2°C/W.
θJC is 11.1°C/W. Junction Temperature = TJ = [VAA (Σ DAC
Output Current + ICCT) × θJA] + Ambient Temperature.
Table 8. Allowable Operating Conditions for KS and KSU
4 DAC ON Double 75R1 Yes +70°C max +70°C max No
4 DAC ON Low Power2 Yes Yes
4 DAC ON Buffering3 Yes Yes
3 DAC ON Double 75R Yes Yes
3 DAC ON Low Power Yes Yes
3 DAC ON Buffering
4 DAC ON Buffering
1 DAC ON Double 75R refers to a condition where the DACs are terminated
in a double 75R load and low power mode is disabled.
2 DAC ON Low Power refers to a condition where the DACs are terminated
in a double 75R load and low power mode is enabled.
3 DAC ON Buffering refers to a condition where the DAC current is reduced
to 5 mA and external buffers are used to drive the video load.
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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