ILOAD = 1mA
ILOAD = 150mA
ILOAD = 10mA
ILOAD = 250mA
ILOAD = 50mA
ILOAD = 300mA
ILOAD = 100mA TJ MAX
VIN – VOUT (V)
Figure 40. Junction Temperature vs. Power Dissipation,
Board Temperature = 85°C
PRINTED CIRCUIT BOARD LAYOUT
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP122/ADP123.
However, as shown in Table 6, a point of diminishing returns
eventually is reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
The input capacitor should be placed as close as possible to the
VIN and GND pins, and the output capacitor should be placed
as close as possible to the VOUT and GND pins. Use of 0402 or
0603 size capacitors and resistors achieves the smallest possible
footprint solution on boards where the area is limited.
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