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ADP122AUJZ-3.3-R7 View Datasheet(PDF) - Analog Devices

Part NameDescriptionManufacturer
ADP122AUJZ-3.3-R7 5.5 V Input, 300 mA, Low Quiescent Current, CMOS Linear Regulator ADI
Analog Devices ADI
ADP122AUJZ-3.3-R7 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ADP122/ADP123
140
120
100
80
60
ILOAD = 1mA
ILOAD = 150mA
ILOAD = 10mA
ILOAD = 250mA
ILOAD = 50mA
ILOAD = 300mA
40
ILOAD = 100mA TJ MAX
20
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
VIN – VOUT (V)
Figure 40. Junction Temperature vs. Power Dissipation,
Board Temperature = 85°C
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP122/ADP123.
However, as shown in Table 6, a point of diminishing returns
eventually is reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
The input capacitor should be placed as close as possible to the
VIN and GND pins, and the output capacitor should be placed
as close as possible to the VOUT and GND pins. Use of 0402 or
0603 size capacitors and resistors achieves the smallest possible
footprint solution on boards where the area is limited.
Rev. 0 | Page 16 of 20
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