datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

ADP121-ACBZ30R7 View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
ADP121-ACBZ30R7 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Data Sheet
140
MAX JUNCTION TEMPERATURE
120
100
80
60
ILOAD = 1mA
ILOAD = 10mA
ILOAD = 25mA
40
ILOAD = 50mA
ILOAD = 75mA
ILOAD = 100mA
20
ILOAD = 150mA
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 46. TSOT, 100 mm2 of PCB Copper, Board Temperature = 85°C
140
MAX JUNCTION TEMPERATURE
120
100
80
60
ILOAD = 1mA
ILOAD = 10mA
ILOAD = 25mA
40
ILOAD = 50mA
ILOAD = 75mA
ILOAD = 100mA
20
ILOAD = 150mA
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 47. WLCSP, 100 mm2 of PCB Copper, Board Temperature = 85°C
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP121. However,
as can be seen from Table 6 and Table 7, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use 0402 or 0603 size capacitors and
resistors to achieve the smallest possible footprint solution on
boards where area is limited.
ADP121
GND
GND
ANALOG DEVICES
ADP121-xx-EVALZ
C1
C2
U1
J1
VIN
VOUT
GND
EN
GND
Figure 48. Example of TSOT PCB Layout
Figure 49. Example of WLCSP PCB Layout—Top Side
Figure 50. Example of WLCSP PCB Layout—Bottom Side
Rev. G | Page 17 of 20
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]