ADP1046AACPZ-RL View Datasheet(PDF) - Analog Devices
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Description
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ADP1046AACPZ-RL Datasheet PDF : 88 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage (Continuous), VDD
Digital Pins: OUTA, OUTB, OUTC, OUTD,
OUTAUX, SR1, SR2, GATE, PGOOD1,
PGOOD2
VS3− to PGND, AGND, DGND
VS1, VS2, VS3+, ACSNS
RTD, ADD
CS1, CS2+, CS2−
FLAGIN, PSON
SDA, SCL
SHAREo, SHAREi
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
RoHS-Compliant Assemblies
(20 sec to 40 sec)
ESD Charged Device Model
ESD Human Body Model
Rating
4.2 V
−0.3 V to VDD + 0.3 V
−0.3 V to +0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +125°C
−65°C to +150°C
150°C
240°C
260°C
1.5 kV
3.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP1046A
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
32-Lead LFCSP
θJA
θJC
44.4 6.4
Unit
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the PCB footprint for the ADP1046A and when soldering the
part onto the PCB. For detailed information about these guide-
lines, see the AN-772 Application Note.
ESD CAUTION
Rev. 0 | Page 9 of 88
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