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ADP1053 View Datasheet(PDF) - Analog Devices

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ADP1053 Datasheet PDF : 84 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage (Continuous), VDD
Digital Pins
VS−_A, VS−_B, PGND_A, PGND_B
to AGND, DGND
Other Analog Pins to AGND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
RoHS Compliant Assemblies
(20 to 40 sec)
ESD
Charged Device Model
Human Body Model
Rating
4.2 V
−0.3 V to VDD + 0.3 V
−0.3 V to +0.3 V
3.6 V
−40°C to +125°C
−65°C to +150°C
150°C
240°C
260°C
1.0 kV
2.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP1053
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
40-Lead LFCSP (CP-40-10) 28.36
2.1
Unit
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the PCB footprint for the ADP1053 and when soldering the
part onto the PCB. For detailed information about these guide-
lines, see the AN-772 Application Note.
ESD CAUTION
Rev. A | Page 9 of 84
 

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