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ADP1053 View Datasheet(PDF) - Analog Devices

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ADP1053 Datasheet PDF : 84 Pages
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Data Sheet
RTD1, RTD2, OTP1, AND OTP2 TRIM
The following procedure should be used:
1. Heat the thermistor or power supply to a known tempera-
ture that is equal to the OTP threshold.
2. Adjust the RTD1 or RTD2 gain trim register (Register 0xFE73
or Register 0xFE74) until the RTD1 or RTD2 value register
(Register 0xFED7 or Register 0xFED8) gives the correct
temperature reading at this temperature.
3. Adjust the OTP1 or OTP2 threshold register (Register 0xFE75
or Register 0xFE76) until the OTP1 or OTP2 flag is set.
This procedure achieves the most accurate OTP, because it takes
into account the part-to-part variations of the ADP1053 and the
thermistor used.
LAYOUT GUIDELINES
This section explains best practices that should be followed to
ensure optimal performance of the ADP1053. In general, all
related control components should be placed as close to the
ADP1053 as possible.
CS2+_A, CS2+_B, CS2−_A, and CS2−_B
The routing of the tracks from the sense resistor to the ADP1053
should be laid out in parallel to each other. The tracks should be
kept close together and as far from switch nodes as possible.
VS+_A, VS+_B, VS−_A, and VS−_B
The routing of the tracks from the remote voltage sense point
to the ADP1053 should be laid out in parallel to each other. The
tracks should be kept close together and as far from switch
nodes as possible.
ADP1053
VDD
Place decoupling capacitors as close to the part as possible. A
330 nF capacitor from VDD to AGND is recommended.
SDA and SCL
The routing of the tracks should be laid out in parallel to each
other. The tracks should be kept close together and as far from
switch nodes as possible.
CS, CS1_A, and CS1_B
Run the tracks from the current sense transformer to the
ADP1053 in parallel to each other. The tracks should be kept
close together and as far from switch nodes as possible.
Exposed Pad
The exposed pad underneath the ADP1053 should be soldered
to AGND.
VCORE
Place the 330 nF capacitor to DGND as close to the part as
possible.
RES
Place the 10 kΩ resistor to AGND as close to the part as
possible.
RTD1 and RTD2
Route a single trace to the ADP1053 from the thermistors. Place
the thermistors close to the hottest part of the power supply.
AGND
Create an AGND ground plane and make a single-point (star)
connection to the power supply system ground.
Rev. A | Page 33 of 84
 

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