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ADM1166ASUZ-REEL View Datasheet(PDF) - Analog Devices

Part NameDescriptionManufacturer
ADM1166ASUZ-REEL Super Sequencer with Margining Control and Nonvolatile Fault Recording ADI
Analog Devices ADI
ADM1166ASUZ-REEL Datasheet PDF : 32 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Voltage on VH Pin
Voltage on VPx Pins
Voltage on VXx Pins
Voltage on AUX1, AUX2 Pins
Voltage on A0, A1 Pins
Voltage on REFIN, REFOUT Pins
Voltage on VDDCAP, VCCP Pins
Voltage on DACx Pins
Voltage on PDOx Pins
Voltage on SDA, SCL Pins
Voltage on GND, AGND, PDOGND, REFGND Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature
Soldering Vapor Phase, 60 sec
ESD Rating, All Pins
Rating
16 V
7V
−0.3 V to +6.5 V
−0.3 V to +5 V
−0.3 V to +7 V
5V
6.5 V
6.5 V
16 V
7V
−0.3 V to +0.3 V
±5 mA
±20 mA
150°C
−65°C to +150°C
215°C
2000 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADM1166
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
Unit
40-Lead LFCSP
26.5
°C/W
48-Lead TQFP
50
°C/W
ESD CAUTION
Rev. 0 | Page 7 of 32
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