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ADL5505 View Datasheet(PDF) - Analog Devices

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ADL5505 Datasheet PDF : 20 Pages
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ADL5505
CALIBRATION FOR IMPROVED ACCURACY
Another way of presenting the error function of the ADL5505
is shown in Figure 42. In this case, the decibel (dB) error at hot
and cold temperatures is calculated with respect to the transfer
function at ambient temperature. This is a key difference in
comparison to Figure 41, in which the error was calculated
with respect to the ideal linear transfer function at ambient
temperature. When this alternative technique is used, the
error at ambient temperature becomes equal to 0 by definition
(see Figure 42).
This plot is a useful tool for estimating temperature drift at a
particular power level with respect to the (nonideal) response
at ambient temperature. The linearity and dynamic range tend
to be improved artificially with this type of plot because the
ADL5505 does not perfectly follow the ideal linear equation
(especially outside of its linear operating range). Achieving
this level of accuracy in an end application requires calibration
at multiple points in the operating range of the device.
In some applications, very high accuracy is required at just one
power level or over a reduced input range. For example, in a
wireless transmitter, the accuracy of the high power amplifier
(HPA) is most critical at or close to full power. The ADL5505
offers a tight error distribution in the high input power range,
as shown in Figure 42. The high accuracy range, beginning
around 6 dBm at 1900 MHz, offers 8 dB of ±0.15 dB detection
error over temperature. Multiple point calibration at ambient
temperature in the reduced range offers precise power
measurement with near 0 dB error from −40°C to +85°C.
3
2
1
+25°C
+85°C
0
–40°C
–1
–2
–3
–25 –20 –15 –10 –5
0
5
10 15
INPUT (dBm)
Figure 42. Error from +25°C Output Voltage at −40°C, +25°C, and +85°C After
Ambient Normalization, 1900 MHz Frequency, 3.0 V Supply
Note that the high accuracy range center varies over frequency
(see Figure 13 to Figure 15 and Figure 19 to Figure 21).
DRIFT OVER A REDUCED TEMPERATURE RANGE
Figure 43 shows the error over temperature for a 1.9 GHz input
signal. The error due to drift over temperature consistently
remains within ±0.15 dB and only begins to exceed this limit
when the ambient temperature rises above +65°C and drops
below −20°C. For all frequencies using a reduced temperature
range, higher measurement accuracy is achievable.
1.00
–40°C –30°C
–20°C –10°C
0.75
0°C
+5ºC
+15°C +25°C
+35°C +45°C
0.50
+55°C +65°C
+75°C +85°C
0.25
0
–0.25
–0.50
–0.75
–1.00
–25 –20 –15 –10 –5
0
5
10 15
INPUT (dBm)
Figure 43. Typical Drift at 1.9 GHz for Various Temperatures
DEVICE HANDLING
The wafer level chip scale package consists of solder bumps
connected to the active side of the die. The part is Pb-free and
RoHS compliant with 95.5% tin, 4.0% silver, and 0.5% copper
solder bump composition. The WLCSP can be mounted on
printed circuit boards using standard surface-mount assembly
techniques; however, caution should be taken to avoid damaging
the die. See the AN-617 Application Note, MicroCSP Wafer
Level Chip Scale Package, for additional information. WLCSP
devices are bumped die; therefore, the exposed die may be
sensitive to light, which can influence specified limits. Lighting
in excess of 600 lux can degrade performance.
LAND PATTERN AND SOLDERING INFORMATION
Pad diameters of 0.20 mm are recommended with a solder paste
mask opening of 0.30 mm. For the RF input trace, a trace width
of 0.30 mm is used, which corresponds to a 50 Ω characteristic
impedance for the dielectric material being used (FR4). All traces
going to the pads are tapered down to 0.15 mm. For the RFIN
line, the length of the tapered section is 0.20 mm.
EVALUATION BOARD
Figure 44 shows the schematic of the ADL5505 evaluation board.
The board is powered by a single supply in the 2.5 V to 3.3 V
range. The power supply is decoupled by 100 pF and 0.1 µF
capacitors.
The RF input has a broadband match of 50 Ω using a single
75 Ω resistor at R7B. More precise matching at spot frequencies
is possible (see the RF Input Interfacing section).
Table 4 details the various configuration options of the evaluation
board. Figure 45 shows the layout of the evaluation board.
Rev. A | Page 18 of 20
 

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