|ADF4156BRUZ-RL||6 GHz Fractional-N Frequency Synthesizer|
|ADF4156BRUZ-RL Datasheet PDF : 24 Pages |
The ADF4156 has a simple SPI®-compatible serial interface for
writing to the device. CLK, DATA, and LE control the data
transfer. When latch enable (LE) is high, the 29 bits that have
been clocked into the input register on each rising edge of
SCLK are transferred to the appropriate latch. See Figure 2 for
the timing diagram and Table 6 for the latch truth table.
The maximum allowable serial clock rate is 20 MHz.
PCB DESIGN GUIDELINES FOR CHIP SCALE
The lands on the lead frame chip scale package (CP-20-1) are
rectangular. The printed circuit board pad for these should be
0.1 mm longer than the package land length and 0.05 mm wider
than the package land width. The land should be centered on
the pad. This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 ounce of
copper to plug the via. The user should connect the printed
circuit board thermal pad to AGND.
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