datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

ADF4108S View Datasheet(PDF) - Analog Devices

Part Name
Description
View to exact match
ADF4108S
ADI
Analog Devices ADI
ADF4108S Datasheet PDF : 21 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ADF4108S
5.0. BURN-IN, LIFE TEST, AND RADIATION
5.1. Burn-in test circuit, Life Test circuit
The test conditions and circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 test condition B & D of MIL-STD-883.
HTRB is not applicable for this drawing.
5.2. Radiation exposure circuit
The radiation exposure circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing and acquiring activity upon request. Total dose irradiation testing
shall be performed in accordance with MIL-STD-883 method 1019, condition A.
6.0. MIL-PRF-38535 QMLV EXCEPTIONS
6.1 Wafer Fabrication
Wafer fabrication occurs at MIL-PRF-38535 QML Class Q certified facility.
6.2 Wafer lot Acceptance (WLA).
Full WLA per MIL-STD-883 TM 5007 is not available for this product. SEM inspection only is available per
MIL-STD-883, TM2018.
7.0. Application Notes
THEORY OF OPERATION
REFERENCE INPUT STAGE
The reference input stage is shown in Figure 4. SW1 and SW2 are normally closed switches. SW3 is normally open.
When power-down is initiated, SW3 is closed and SW1 and SW2 are opened. This ensures that there is no loading of
the REFIN pin on power-down.
Figure 4. Reference Input Stage
ASD0016548 Rev. A | Page 9 of 21
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]